![]() ![]() When using the temperature measuring instrument, there are the following methods need to be noted.ġ. Measurement must be used when the board has been mountedįirst of all, the thermal analysis of the PCB components, due to the different thermal properties of the PCB, the size of the components and material differences, etc., the actual heat rise at each point is not the same, to find the most hot and cold points, you can measure the highest temperature and the lowest temperature.Ģ. Set up more test points to detect the real heat stateįor example, the center of the PCBA board and the edge of the heat is not the same, large volume components and small components with different heat capacity and heat-sensitive components parts must be set up test points.ģ. Thermocouple probe shape is tiny, must be fixed in the test position with the specified high-temperature solder or adhesive, otherwise heat loosening, deviating from the intended test point, causing test errors. Measurement available solder, high temperature tape fixed in the test point, open the switch of the tester, temperature measurement instrument with the PCBA into the furnace cavity, according to the programming process and speed of sampling and recording the furnace temperature, test records are completed, the tester will be connected to the printer, you can print out the temperature curve graph of different temperature zones. Reflow soldering temperature profile measurement temperature, you need to use the temperature profile tester. ![]() Therefore SMD processing reflow soldering temperature profile control is very important Reflow oven generally has 4 temperature zones, respectively, heat absorption zone, constant temperature zone, soldering zone, cooling zone, the temperature of different areas need to be different, so as to achieve excellent soldering quality, thereby improving the welding through rate, reduce the welding defect rate. The front end of the SMD processing is stencil printer and SMT machine, the back end requires reflow soldering machine high temperature welding, the solder paste will melt the electronic components and pads tightly fixed together to prevent falling off. ![]()
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